Component mounting apparatus

ABSTRACT

A component mounting apparatus includes a board transfer section for carrying in one of circuit boards to a component mounting position and carrying out the circuit board after component-mounting, a component feed section for feeding to a specified position a component to be mounted onto the circuit board, a component mounting section for loading a suction nozzle matching the component to be mounted, sucking up the-component from the component feed section and moving the component to the mounting position, and mounting the component to a specified site of the circuit board, a controller for controlling operations of the individual sections to execute a productional operation of component-mounting onto the circuit boards, and a remaining-component discarding device for performing an operation of discarding a component which remains at the suction nozzle during a time period for which the component-mounting operation by the component mounting section is kept halted.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a component mounting apparatusfor mounting electronic components onto circuit boards.

[0002] Component mounting apparatuses for mounting electronic componentsonto boards to produce component mounted boards are required toimplement such stable operation as will prevent occurrences of apparatusfaults due to operational errors of the apparatus or human errors or thelike.

[0003] Arrangement of a prior art example of such component mountingapparatuses is shown in FIG. 5. This component mounting apparatus 40comprises: a transfer section 42 for transferring to a specifiedposition a circuit board 43 onto which components are to be mounted; afeed section 41 for feeding to a specified position a component 44 whichis to be mounted onto the circuit board 43; an X-Y robot 47 equippedwith a head 45 having a suction nozzle 49 for sucking up the component44 from the feed section 41 and mounting it onto the circuit board 43and with a board recognition camera 46 for the positioning of a mountingposition; and a nozzle station 50 for storing a plurality of suctionnozzles 49 corresponding to a plurality of components 44.

[0004] In this arrangement, the circuit board 43 is transferred to aspecified mounting position by the transfer section 42. in order to loadto the head 45 a suction nozzle 49 corresponding to the component 44 tobe mounted, the X-Y robot 47 moves the head 45 to above the nozzlestation 50, separates the currently loaded suction nozzle 49 from thehead 45, and then loads to the head 45 a suction nozzle 49 matching thecomponent 44 to be next mounted. Next, the X-Y robot 47 moves the boardrecognition camera 46 to above the circuit board 43 and measures a boardmark 51 provided on the circuit board 43, thus accomplishing anoperation of recognizing the mounting position. Subsequently, the X-Yrobot 47 moves the head 45 to the feed section 41, sucks up the fedcomponent 44 by the suction nozzle 49, and moves the head 45 to abovethe mounting position on the circuit board 43. In this operation, thesuction posture in which the component 44 is sucked up by the suctionnozzle 49 is recognized by a component recognition camera 52. Based onthis component posture information, an operation of correcting thesuction posture is performed, and the component 44 is mounted to thespecified position on the circuit board 43.

[0005] In production processes with the component mounting apparatus asdescribed above, it can occur that the operation of the apparatus isstopped due to the state of the apparatus, mis-feedings of components,and the like. When the apparatus is restarted after such a temporarystop, there are some cases where an unmounted component remains stickingto the suction nozzle due to residual pressure of the vacuum of thesuction nozzle. In this state as it is, if a switching operation of thesuction nozzle is executed, the component would enter the pocket of thenozzle station, causing the apparatus to be damaged, as a disadvantage.

[0006] The suction nozzle for sucking up abnormal-shaped components orsmall-sized components such as connectors and transformers with lessarea of flat surfaces is more likely to suffer suction errors due toclogging with dusts or the like, so that the maintenance of the suctionnozzle needs to be exercised on demand. The operator would take out thesuction nozzle from the apparatus and, after cleaning it, accommodate itto the apparatus. In this process, there may occur human errors such asmis-positioning in returning the suction nozzle. Because the suctionnozzle is controlled by a controller that controls the operation of thecomponent mounting apparatus, a mis-positioning in returning the nozzleby the operator would, in some cases, cause the component mountingapparatus to be damaged due to inconsistency with the controllingoperation of the apparatus, as another disadvantage.

[0007] Besides the above disadvantages, the number of kinds of suctionnozzles has been increasing with diversified components to be mounted sothat frequency changeovers of suction nozzles are needed in theproduction of one circuit board. As a result, there has arisen a demandfor a stable operation that ensures a reliable execution of the controlof suction nozzles.

SUMMARY OF THE INVENTION

[0008] An object of the present invention is therefore to provide acomponent mounting apparatus which prevents occurrences of apparatuserrors and human errors and thus performs stable working operation.

[0009] In accomplishing these and other aspects, according to a firstaspect of the present invention, there is provided a component mountingapparatus comprising:

[0010] a board transfer section for carrying in one of circuit boards toa component mounting position and carrying out the circuit board aftercomponent-mounting;

[0011] a component feed section for feeding to a specified position acomponent to be mounted onto the circuit board;

[0012] a component mounting section for loading a suction nozzlematching the component to be mounted, sucking up the component from thecomponent feed section and moving the component to the mountingposition, and mounting the component to a specified site of the circuitboard;

[0013] a controller for controlling operations of the individualsections to execute a productional operation of component-mounting ontothe circuit boards; and

[0014] a remaining-component discarding device for performing anoperation of discarding a component which remains at the suction nozzleduring a time period for which the component-mounting operation by thecomponent mounting section is kept halted.

[0015] According to a second aspect of the present invention, there isprovided a component mounting apparatus according to the first aspect,wherein the component mounting section selects the suction nozzlematching the component to be mounted, from among a plurality of suctionnozzles, and loads the suction nozzle.

[0016] According to a third aspect of the present invention, there isprovided a component mounting apparatus comprising:

[0017] a board transfer section for carrying in one of circuit boards toa component mounting position and carrying out the circuit board aftercomponent-mounting;

[0018] a component feed section for feeding to a specified position acomponent to be mounted onto the circuit board;

[0019] a component mounting section for selecting and loading a suctionnozzle matching the component to be mounted, from among a plurality ofsuction nozzles, sucking up the component from the component feedsection and moving the component to the mounting position, and mountingthe component to a specified site of the circuit board;

[0020] a controller for controlling operations of the individualsections to execute a productional operation of component-mounting ontothe circuit boards; and

[0021] a nozzle identifying device for performing an operation ofidentifying the suction nozzle during a time period for which thecomponent-mounting operation by the component mounting section is kepthalted.

[0022] According to a fourth aspect of the present invention, there isprovided a component mounting apparatus comprising:

[0023] a board transfer section-for carrying in one of circuit boards toa component mounting position and carrying out the circuit board aftercomponent-mounting;

[0024] a component feed section for feeding to a specified position acomponent to be mounted onto the circuit board; and

[0025] a component mounting section for selecting and loading a suctionnozzle matching the component to be mounted, from among a plurality ofsuction nozzles, sucking up the component from the component feedsection and moving the component to the mounting position, and mountingthe component to a specified site of the circuit board;

[0026] a controller for controlling operations of the individualsections to execute a productional operation of component-mounting ontothe circuit boards;

[0027] a remaining-component discarding device for performing anoperation of discarding a component which remains at the suction nozzleduring a time period for which the component-mounting operation by thecomponent mounting section is kept halted; and

[0028] a nozzle identifying device for performing an operation ofidentifying the suction nozzle during a time period for which thecomponent mounting operation by the component mounting section is kepthalted.

[0029] According to a fifth aspect of the present invention, there isprovided a component mounting apparatus according to the first aspect,wherein the time period for which the component mounting operation iskept halted is a time elapse since the circuit board after the componentmounting is carried in by the board transfer section until a nextcircuit board is carried in to the mounting position.

[0030] According to a sixth aspect of the present invention, there isprovided a component mounting apparatus according to the second aspect,wherein the time period for which the component mounting operation iskept halted is a time elapse since the circuit board after the componentmounting is carried in by the board transfer section until a nextcircuit board is carried in to the mounting position.

[0031] According to a seventh aspect of the present invention, there isprovided a component mounting apparatus according to the third aspect,wherein the time period for which the component mounting operation iskept halted is a time elapse since the circuit board after the componentmounting is carried in by the board transfer section until a nextcircuit board is carried in to the mounting position.

[0032] According to an eighth aspect of the present invention, there isprovided a component mounting apparatus according to the fourth aspect,wherein the time period for which the component mounting operation iskept halted is a time elapse since the circuit board after the componentmounting is carried in by the board transfer section until a nextcircuit board is carried in to the mounting position.

[0033] According to a ninth aspect of the present invention, there isprovided a component mounting apparatus according to the third aspect,wherein the identifying operation by the nozzle identifying device is anidentification as to whether or not a suction nozzle has been loaded toa specified position.

[0034] According to a tenth aspect of the present invention, there isprovided a component mounting apparatus according to the fourth aspect,wherein the identifying operation by the nozzle identifying device is anidentification as to whether or not a suction nozzle has been loaded toa specified position.

[0035] According to an eleventh aspect of the present invention, thereis provided a component mounting apparatus according to the thirdaspect, wherein the identifying operation by the nozzle identifyingdevice is an operation for identifying a coincidence between the loadedsuction nozzle and control data.

[0036] According to a twelfth aspect of the present invention, there isprovided a component mounting apparatus according to the fourth aspect,wherein the identifying operation by the nozzle identifying device is anoperation for identifying a coincidence between the loaded suctionnozzle and control data.

[0037] According to the first and second aspects, during a time periodin which the suction nozzle is out of the component mounting operation,a component remaining at the suction nozzle by vacuum residual pressureis discarded by the remaining-component discarding device. Thus, anyerrors of the apparatus operation as well as faults due to remainingcomponents can be prevented from occurring. Also, performing thediscarding operation by the exhaust of compressed air allows dusts andthe like sticking to the suction nozzle to be removed away.

[0038] According to the third aspect, during a time period in which thesuction nozzle is out of the component mounting operation, the presenceor absence and kind of a loaded suction nozzle is identified by thenozzle identifying device. Thus, any errors of the apparatus operationas well as faults due to some errors of the operator or the like can beprevented from occurring.

[0039] According to the fourth aspect, during a time period in which thesuction nozzle is out of the component mounting operation, a componentremaining at the suction nozzle by vacuum residual pressure is discardedby the remaining-component discarding device. Thus, any errors of theapparatus operation as well as faults due to remaining components can beprevented from occurring. Also, performing the discarding operation bythe exhaust of compressed air allows dusts and the like sticking to thesuction nozzle to be removed away. Furthermore, by performing theidentification of presence or absence as well as kind of a loadedsuction nozzle by the nozzle identifying device, any errors of theapparatus operation as well as faults due to some errors of the operatorand the like can be prevented from occurring.

[0040] According to the aspects, the time period for carrying in and outcircuit boards is a time period for which the mounting operation is kepthalted. By performing the aforementioned individual operations duringthis time period, the operations of clearing and identifying the suctionnozzle can be achieved.

BRIEF DESCRIPTION OF THE DRAWINGS

[0041] These and other aspects and features of the present inventionwill become clear from the following description taken in conjunctionwith the preferred embodiments thereof with reference to theaccompanying drawings, in which:

[0042]FIG. 1 is a perspective view showing a partial arrangement of acomponent mounting apparatus according to one embodiment of the presentinvention;

[0043]FIG. 2 is a perspective view showing a general arrangement of thecomponent mounting apparatus;

[0044]FIG. 3 is a time chart for explaining the operation by thecomponent mounting apparatus;

[0045]FIG. 4 is a flow chart for explaining the operation by thecomponent mounting apparatus; and

[0046]FIG. 5 is a perspective view showing the arrangement of acomponent mounting apparatus according to the prior art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0047] Before the description of the present invention proceeds, it isto be noted that like parts are designated by like reference numeralsthroughout the accompanying drawings.

[0048] Hereinbelow, one embodiment of the present invention is describedwith reference to the accompanying drawings for an understanding of thepresent invention. The embodiment below is only an example of embodyingthe present invention, and should not be construed as limiting thetechnical scope of the present invention.

[0049] First, the arrangement of a component mounting apparatusaccording to one embodiment of the present invention is explained withreference to FIGS. 1 and 2. FIGS. 1 and 2 are perspective views showingthe arrangement of the component mounting apparatus, where FIG. 2 showsits general arrangement and FIG. 1 shows its partial arrangement.

[0050] Referring to FIG. 2, the component mounting apparatus 1comprises: a board transfer section 9 equipped with a loader 11 forloading a circuit board 2 coming up from the preceding step, to acomponent mounting position within the apparatus, and with an unloader12 for carrying out the circuit board 2 having components mountedthereon to the succeeding step; an X-Y robot (serving as an example ofthe component mounting section) 8 for picking up a component to bemounted from a reel type component feed section 13 and a tray typecomponent feed section 14 and mounting it onto the circuit board 2; anda component recognition camera 7 For taking an image of the suctionposture of the component sucked up by a suction nozzle equipped to theX-Y robot 8. Operations of these members are controlled by a controller500. A main-part arrangement of this component mounting apparatus 1 andits operation are explained below with reference to FIG. 1.

[0051] Referring to FIG. 1, a head 3 of the X-Y robot 8 is equipped withnozzle holders 16, 17 for removably loading a suction nozzle 19 thatsucks up and holds a component 5, and with a board recognition camera 10for recognizing the component mounting position. A plurality of suctionnozzles 19 suited to suck up a plurality of kinds of components to bemounted onto the circuit board 2 are accommodated at their respectivespecified positions of a nozzle station 6. Based on control programs ofthe apparatus, the X-Y robot 8 selects from the nozzle station 6 suctionnozzles 19 suited to suck up the components, and loads the suctionnozzles 19 to the nozzle holder 16, 17. Whereas the component 5 issucked up from the component feed section 14 and held by each of thesuction nozzles 19, the suction posture of the component 5 is recognizedby the component recognition camera 7, and any shift from a referenceposture is corrected by rotation of each of the nozzle holders 16, 17.The head 3, to which the component has been sucked up by the suctionnozzle 19, is moved to above the circuit board 2 held to a main holdingsection, which is the specified mounting position, where a board mark 18provided on the circuit board 2 is shot by the board recognition camera10 so that the mounting position is recognized. Then, based on thisrecognition data, the component 5 is mounted to the specified position.

[0052] In FIG. 1, a box-like article depicted below the head 3 is acomponent discarding box 4, which is equipped, on its one side, with atransmission sensor (serving as one example of the nozzle identifyingdevice) 20 for deciding the presence or absence of the suction nozzle 19based on that the optical axis is cut off by the loaded suction nozzle19 when the nozzle holder 16 or 17 is lowered. Also, each suction nozzle19, which is provided with a nozzle identifying mark 22 such as a barcode that differs from nozzle to nozzle, is recognized by a nozzleidentifying sensor (nozzle identifying device) 21.

[0053] The controller 500 is connected to the board transfer section 9with the loader 11 and unloader 12; the reel type component feed section13; the tray type component feed section 14; the component recognitioncamera 7; the X-Y robot 8 with the head 3, the board recognition camera10, the nozzle holders 16, 17; the transmission sensor 20; the nozzleidentifying sensor 21; and the compressor 501 to control theseoperations.

[0054] Now the fault preventing operation in the component mountingapparatus 1 constructed as described above is described below withreference to the time chart of FIG. 3 as well as the flow chart of FIG.4.

[0055] Referring to FIG. 3, upon receiving a signal EOP (End of Program)representing an end of mounting process for one circuit board 2, thecomponent mounting apparatus 1 puts the board transfer section 9 intooperation, so that the component-mounted circuit board 2 is transferredfrom the main holding section to the unloader 12 ({circle over (1)} inFIG. 3). With the circuit board 2 removed away from the main holdingsection, a circuit board 2 to be used for the next mounting process iscarried into the main holding section from the loader 11 ({circle over(2)} in FIG. 3). The circuit board 2 that has been transferred to theunloader 12 is carried out in response to a request from the next step({circle over (3)} in FIG. 3). With no circuit board 2 present on theloader 11, when a circuit board 2 that is over the preceding step iscarried into the loader 11, a preparation for the next mounting processis made ({circle over (4)} in FIG. 3).

[0056] In the productional operation with the component mountingapparatus 1, as seen above, a wasteful time Ts is needed for thecarriage-in and -out of the circuit board 2 before a circuit board 2 forthe mounting process comes to be held at the main holding section. Bymaking use of this wasteful time Ts, identification and clearance of thesuction nozzles 19 that have been loaded to the head 3 are executed, sothat the operation of preventing such faults as mismatch and clogging ofthe suction nozzle 19 is implemented, which characterizes the componentmounting apparatus 1 according to the present embodiment. This operationis explained below with reference to the flow chart of FIG. 4. It isnoted that reference characters S1, S2, . . . shown in FIG. 4 are stepnumbers showing the operating procedure, being coincident with numbersincorporated in the description herein.

[0057] Referring to FIG. 4, when the transfer operation of the circuitboard 2 is started (S1), the X-Y robot 8 moves the head 3 to above thecomponent discarding box 4 (S2). When the head 3 have the suctionnozzles 19 lowered to a specified descent point, compressed air is fedfrom a compressor 501 to one of the suction nozzles 19, by which thecomponent 5, if remaining at the suction nozzle 19 due to vacuumresidual pressure, is removed while dusts and the like sticking to thesuction nozzle 19 are removed away simultaneously (S3).

[0058] During this operation, the transmission sensor 20 checks whetheror not the suction nozzle 19 of the head 3 is present (S4). Also, thenozzle identifying sensor 21 identifies the suction nozzle 19 that hasbeen loaded, by which the matching to the current head controlled by thememory of the controller 500 is checked (S5). As a result of thisdecision, if a mismatch of the suction nozzle 19 is confirmed, then theoperation of the component mounting apparatus 1 is halted (S10), while amessage representing occurrence of a mismatch is outputted (S11). If amatching between the loaded suction nozzle 19 and the memory isconfirmed, then the exhaust of compressed air is halted, where the head3 moves up the suction nozzle 19.

[0059] Since the head 3 is equipped with a plurality (n) of suctionnozzles 19, the X-Y robot 8 moves the next suction nozzle 19 to aspecified position on the component discarding box 4, executing the sameoperations as the steps S3 to S5. This operation of nozzle clearance anddecision is repeated until all the n suction nozzles 19 are completelytreated (S6 and S7). The X-Y robot 8, after the completion of nozzledecision (S8), moves the head 3 to the nozzle station 6, disconnectingthe currently loaded suction nozzle 19 and loading a suction nozzle 19matching the next-sucked component 5 to the head 3. Now if the transferof the circuit board 2 to the main holding section by the board transfersection 9 has been completed (S9), the mounting operation of thecomponent mounting apparatus 1 can be started.

[0060] The component mounting apparatus 1 according to this embodimentas described above has been so arranged as to be capable of executingall the functions of discarding the component remaining at the suctionnozzle 19, detecting the presence or absence of a suction nozzle 19loaded to the head 3, and deciding a matching between the suction nozzle19 loaded to the head 3 and the control memory. Instead, any of thesefunctions may be adopted singly.

[0061] Also, the component mounting apparatus 1 according to thisembodiment has been so arranged as to be able to execute the faultpreventing operation during the transfer of the circuit board 2.However, the fault preventing operation may also be executed during aperiod for which the X-Y robot 8 keeps out of the mounting operation ofthe component 5, including the duration of transfer of the circuitboard, for example during a period for which the apparatus operationkeeps halted due to the state of the apparatus, mis-feeding ofcomponents, or the like.

[0062] Furthermore, the transmission sensor 20 for detecting thepresence or absence of a suction nozzle 19 and the nozzle identifyingsensor 21 for making the decision and recognition on the suction nozzle19 may also be equipped to the head 3 so that a plurality of suctionnozzles 19 are moved up and down so as to be checked one after another.

[0063] As described above, according to the first and second aspects ofthe present invention, since the operation of discarding remainingcomponents is executed during the period in which the component mountingoperation is halted, a component, even if remaining at the suctionnozzle due to vacuum remaining pressure, is removed by the exhaust ofcompressed air. As a result, any apparatus faults due to remainingcomponents can be prevented from occurring. Also, since the exhaust ofcompressed air removes dusts and the like sticking to the suctionnozzle, such trouble as suction errors of the suction nozzle can beprevented from occurring, so that a stable apparatus operation can berealized.

[0064] According to the third aspect of the present invention, duringthe period in which the component mounting operation is halted, thepresence or absence of a suction nozzle loaded to the head can bedetected by moving the suction nozzle to a specified position andmoreover the identification of the kind of the suction nozzle loaded tothe head can be achieved. Therefore, any errors of the loaded oraccommodated position of the suction nozzle due to some error of theoperator can be detected so that operating loss or other losses due toapparatus faults can be prevented.

[0065] According to the fourth aspect of the present invention, duringthe operations of discarding the remaining components and removing dustsand the like, the checking of presence or absence of the loaded suctionnozzle as well as its identification can be executed simultaneously.Therefore, there can be provided a component mounting apparatus whichcontributes to a stable production free from any operating errors andhuman errors.

[0066] Also, the period in which the component mounting operation ishalted can be set to the wasteful time during which the circuit board istransferred. Therefore, the clearance and identification of the suctionnozzle can be executed by making effective use of the wasteful time.

[0067] The entire disclosure of Japanese Patent Application No. 8-225088filed on Aug. 27, 1996, including specification, claims, drawings, andsummary are incorporated herein by reference in its entirety.

[0068] Although the present invention has been fully described inconnection with the preferred embodiments thereof with reference to theaccompanying drawings, it is to be noted that various changes andmodifications are apparent to those skilled in the art. Such changes andmodifications are to be understood as included within the scope of thepresent invention as defined by the appended claims unless they departtherefrom.

What is claimed is:
 1. A component mounting apparatus comprising: aboard transfer section for carrying in one of circuit boards to acomponent mounting position and carrying out the circuit board aftercomponent-mounting; a component feed section for feeding to a specifiedposition a component to be mounted onto the circuit board; a componentmounting section for loading a suction nozzle matching the component tobe mounted, sucking up the component from the component feed section andmoving the component to the mounting position, and mounting thecomponent to a specified site of the circuit board; a controller forcontrolling operations of the individual sections to execute aproductional operation of component-mounting onto the circuit boards;and a remaining-component discarding device for performing an operationof discarding a component which remains at the suction nozzle during atime period for which the component-mounting operation by the componentmounting section is kept halted.
 2. A component mounting apparatusaccording to claim 1, wherein the component mounting section selects thesuction nozzle matching the component to be mounted, from among aplurality of suction nozzles, and loads the suction nozzle.
 3. Acomponent mounting apparatus comprising: a board transfer section forcarrying in one of circuit boards to a component mounting position andcarrying out the circuit board after component-mounting; a componentfeed section for feeding to a specified position a component to bemounted onto the circuit board; a component mounting section forselecting and loading a suction nozzle matching the component to bemounted, from among a plurality of suction nozzles, sucking up thecomponent from the component feed section and moving the component tothe mounting position, and mounting the component to a specified site ofthe circuit board; a controller for controlling operations of theindividual sections to execute a productional operation ofcomponent-mounting onto the circuit boards; and a nozzle identifyingdevice for performing an operation of identifying the suction nozzleduring a time period for which the component-mounting operation by thecomponent mounting section is kept halted.
 4. A component mountingapparatus comprising: a board transfer section for carrying in one ofcircuit boards to a component mounting position and carrying out thecircuit board after component-mounting; a component feed section forfeeding to a specified position a component to be mounted onto thecircuit board; and a component mounting section for selecting andloading a suction nozzle matching the component to be mounted, fromamong a plurality of suction nozzles, sucking up the component from thecomponent feed section and moving the component to the mountingposition, and mounting the component to a specified site of the circuitboard; a controller for controlling operations of the individualsections to execute a productional operation of component-mounting ontothe circuit boards; a remaining-component discarding device forperforming an operation of discarding a component which remains at thesuction nozzle during a time period for which the component-mountingoperation by the component mounting section is kept halted; and a nozzleidentifying device for performing an operation of identifying thesuction nozzle during a time period for which the component mountingoperation by the component mounting section is kept halted.
 5. Thecomponent mounting apparatus according to claim 1, wherein the timeperiod for which the component mounting operation is kept halted is atime elapse since the circuit board after the component mounting iscarried in by the board transfer section until a next circuit board iscarried in to the mounting position.
 6. The component mounting apparatusaccording to claim 2, wherein the time period for which the componentmounting operation is kept halted is a time elapse since the circuitboard after the component mounting is carried in by the board transfersection until a next circuit board is carried in to the mountingposition.
 7. The component mounting apparatus according to claim 3,wherein the time period for which the component mounting operation iskept halted is a time elapse since the circuit board after the componentmounting is carried in by the board transfer section until a nextcircuit board is carried in to the mounting position.
 8. The componentmounting apparatus according to claim 4, wherein the time period forwhich the component mounting operation is kept halted is a time elapsesince the circuit board after the component mounting is carried in bythe board transfer section until a next circuit board is carried in tothe mounting position.
 9. The component mounting apparatus according toclaim 3, wherein the identifying operation by the nozzle identifyingdevice is an identification as to whether or not a suction nozzle hasbeen loaded to a specified position.
 10. The component mountingapparatus according to claim 4, wherein the identifying operation by thenozzle identifying device is an identification as to whether or not asuction nozzle has been loaded to a specified position.
 11. Thecomponent mounting apparatus according to claim 3, wherein theidentifying operation by the nozzle identifying device is an operationfor identifying a coincidence between the loaded suction nozzle andcontrol data.
 12. The component mounting apparatus according to claim 4,wherein the identifying operation by the nozzle identifying device is anoperation for identifying a coincidence between the loaded suctionnozzle and control data.